Rising Investments in R&D Fuel High-Speed Connector Market Growth

In response to the surging demand for high-speed connectors, companies are increasingly investing in the development of new and innovative product offerings. A few of the major product developments in the high-speed connector market are mentioned below.

• In May 2022, Carlisle Interconnect Technologies (CarlisleIT), a division of Carlisle Companies (CSL), announced the newest product of its Octax Hybrid line of high-speed data connectors. These connectors are ideal for defense, commercial aviation, and industrial applications. This new series of high-performance, multi-port connectors combines 10 GB of data with additional discrete in a single 38999 shell.

• In September 2021, Amphenol ICC (one of the global leaders in connector technology design and manufacturing) and eTopus Technology announced the deployment of a platform with 112 Gbps interconnect technology in their products. This solution is suited for high-speed communications, artificial intelligence (AI), machine learning (ML), and industrial and instrumentation applications. This interconnect uses the four-level pulse amplitude modulation (PAM4) technology that allows the packing of the maximum possible bandwidth into each communication channel.

• In June 2023, PIC Wire & Cable unveiled the latest addition to the MACHFORCE product family—the MACHFORCE PCB connector. This cutting-edge innovation offers a direct PCB mounting solution, in turn, enhancing mechanical stability, signal integrity, and space efficiency in rugged computers and switches that are used across the aerospace industry. MACHFORCE connectors feature high-speed modules (HSM) designed for superior electrical performance, unlocked by linear module configuration, isolated twisted pairs, and dielectric materials, which ultimately contribute to impressive impedance control and signal isolation.

• In November 2023, Fischer Connectors released new high-speed connectors and cable assemblies for ultrahigh-definition (UHD) audio/video data transfer at a rate of 18 Gbit/s in demanding environments, matching the performance speed of HDMI 2.0.

• In February 2021, Kyocera Corporation launched a new series of 0.5 mm-pitch floating board-to-board connectors for high-speed 16 Gbit/s data transmission. The new connectors (F/P*1 = 170%) can float within ±0.85 mm for easy and accurate mating. They are sold under the 5652 Series designation.

Innovations in high-speed connectors, following high investments from manufacturers to strengthen their product portfolios with the addition of innovative products based on changing consumer requirements, boost the high-speed connector market growth.

High-Speed Connector Market: Industry Overview

The high-speed connector market is segmented based on product, application, and geography. Based on product, the market is fragmented into board-to-cable, board-to-board, and others. By application, the market is segmented into communications, automotive, aerospace & defense, energy & power, electronics, and others. Based on geography, the market is segmented into North America, Europe, Asia Pacific, the Middle East & Africa, and South & Central America.

US Dominates High-Speed Connector Market in North America

The high-speed connector market is segmented into five major regions—North America, Europe, Asia Pacific, the Middle East & Africa, and South America. In 2023, North America led the global market with a substantial revenue share, followed by Asia Pacific and Europe, respectively. The rising networking and communication sector favors the North American high-speed connector market growth. These connectors are increasingly being utilized in the networking and communication sector to offer enhanced connectivity, reliability, and high-speed data transfer. Rising investments in the developments of various sectors, including telecommunications, automotive, and consumer electronics, along with the increasing adoption of IoT devices propel the demand for high-speed connectors. In 2022, the broadband industry in the US invested US$ 102.4 billion in US communications infrastructure in 2022, showing broadband providers’ determination to achieve the national objective of high-speed, affordable, and reliable connectivity. Moreover, investments in the communications sector rose by 19% year-on-year in 2022. High-speed connectors play a vital role in the communications industry, enabling the transmission of large volumes of data at high speeds. They are essential components in various applications, including telecommunications infrastructure and data centers.

High-Speed Connector Market Analysis: Competitive Landscape and Key Developments

Samtec, Molex LLC, TE Connectivity, Hirose Electric Co, LTD., Yamaichi, Neoconix, Fujitsu, Omron, IMS Connector Systems, Oupiin Enterprise Co. Ltd, Amphenol are among the key companies profiled in the high-speed connector market report. The market focuses on new product launch, expansion and diversification, and acquisition strategies, which allow them to access prevailing business opportunities.

• In January 2024, Amphenol Corporation, a prominent global provider of advanced interconnect, antenna, and sensor solutions, announced a definitive agreement to acquire the Carlisle Interconnect Technologies (CIT) business from Carlisle Companies Incorporated (NYSE: CSL) for a cash consideration of US$ 2.025 billion, subject to customary post-closing adjustments. CIT is a leading supplier of rugged interconnect solutions primarily designed for the commercial air, defense, and industrial sectors. It is projected to generate approximately US$ 900 million in sales and has an adjusted Earnings Before Interest, Taxes, Depreciation, and Amortization (EBITDA) margin of ~20% in 2024.

• In January 2023, Amphenol Communications Solutions launched the latest addition to its product lineup, the PCIe Gen 6 Mini Cool Edge IO GH01 Series. Developed in collaboration with the PCI-SIG association, these connectors offer exceptional performance in terms of high-speed data transfer and compact design, featuring a 0.6mm pitch. Designed to meet the stringent requirements of Gen 6 SI performance at 85ohm impedance, these connectors are perfectly suited for a wide range of applications. They find particular relevance in servers, data centers, storage systems, workstations, and networking equipment, enabling the seamless integration of big data applications such as Artificial Intelligence and Machine Learning.

• In September 2021, Amphenol ICC, a global leader in connector technology, design, and manufacturing, collaborated with eTopus Technology, a pioneer in ultra-high-speed ADC/DSP-based SerDes, to develop a groundbreaking 112Gb/s interconnect technology. This innovative solution combines Amphenol ICC’s expertise in connector technology with eTopus Technology’s advanced SerDes capabilities. The 112Gb/s interconnect technology is designed to meet the demands of high-speed communications, machine learning (ML), artificial intelligence (AI), and industrial and instrumentation applications. By utilizing 112Gb/s four-level pulse amplitude modulation (PAM4) technology, these interconnects maximize the bandwidth available in each communication channel.